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Ecma helps to remove EMC standards roadblock

Ecma International Experts contribute revised European Norm (EN 55022) to CENELEC: interim solution solves both technical and procedural problems


Industry Contact
Jan W. van den Beld
Ecma Secretary-General
Press Contact
Martin Jacklin
Ecma Media Relations


Press Release in pdf-format

Geneva, 11 November 2004 :

Geneva, Switzerland – 11 November 2004 – Information and Communication Technology (ICT) and Consumer Electronics (CE) experts in Ecma International (Ecma) have submitted to the European Committee for Electrotechnical Standardization (CENELEC) a revised edition of the European Standard on Electromagnetic Compatibility (EMC) – European Norm (EN) 55022. The new draft resolves both technical and procedural problems with currently enforced EMC standards. Notably, it will allow industry to avoid the duplication of tests and it includes the Common Modifications requested by European National committees. Ecma International proposes that CENELEC endorses this draft as EN 55022:2005.

The problem with EN 55022 solved by Ecma is both procedural and technical. The 2 nd edition of EN 55022 will be withdrawn on August 1 st 2005, leaving Europe with the 3 rd edition only. The 3 rd edition, however, is deemed unusable by Industry, particularly for measurements of conducted emissions on telecommunication ports.

EN 55022 is the European equivalent of the International IEC standard, CISPR 22. CISPR is the International Special Committee on Radio Interference.

TC20 has drafted the next edition of EN 55022 by adding the accepted Common Modifications. This draft also solves the problems with measurements of conducted emissions on telecommunication ports and removes the need to use ferrite clamps.

The drafting work was done in Ecma Technical Committee 20 (TC20), which commands a unique position among the bodies involved in developing EMC standards. International ICT and CE industry members send experts to Ecma TC20 to address EMC issues. TC20 takes a global view of EMC standards from all recognized bodies (IEC/CISPR, CENELEC, ETSI), and it makes contributions where needed.

Jan van den Beld , Ecma International Secretary General noted, “Above all, Ecma members are committed to promote interworking of systems and devices and to avoid interference. Delay in adoption of appropriate standards with emission measurements and limits poses a problem for all. We are pleased to see that our members once more have used our unique position to help effectively in removing this roadblock.”

“Ecma is in a critical non-formal role, making a vital timesaving contribution, allowing ICT and CE industry experts to input common positions, which expedite and assist the process of EMC standardisation,” said John Wagner (Avaya), in his role as Chairman of Ecma TC20, “This contribution provides a solution to the imminent problem, and we continue to contribute to the next edition of EN 55022.”.

“We invite technical experts from ICT and CE industry companies to become active in the work of Ecma TC20.”

Find out more about Ecma TC20 at:

About Ecma International

Since its inception in 1961, Ecma International (Ecma) has developed standards for information and communication technology (ICT) and consumer electronics (CE). Ecma is a not-for-profit industry association of technology developers, vendors and users. Industry and other experts work together in Ecma to complete standards. Ecma submits the approved work for approval as ISO, IEC, CENELEC and ETSI standards.

Ecma is the inventor and main practitioner of “fast tracking” of specifications through the standardization process in Global Standards Bodies like the ISO. In ISO/IEC JTC 1, Ecma has the status of an A-liaison, equivalent to a national body without voting rights. Since the start of fast-tracking in 1987, over 200 (more than 80%) of the total number of proposals for fast-track processing have come from Ecma International, and have been approved.

Main areas of standardization include: Scripting and programming languages; Optical and Magnetic storage media; High speed interconnects; Universal 3D format; Safety, Environmental, Acoustical and Electromagnetic product attributes; Enterprise and Proximity Communication and Networking; and File and Volume structures. Publications can be downloaded free of charge from